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New Conductor (Trace) Sizing Charts IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design, is written specifically for the carrying capacity of conductor current. Additional charts are provided that separate the variables that impact the temperature rise of a trace when current is applied. There is a baseline set of charts for internal and external conductors. The baseline is conservative for most designs, although generally less conservative than the IPC 2221 internal conductor-sizing chart. The difference between the new and old is that attention is given to parameters that affect the temperature rise of a trace; some of these parameters include the board thickness, presence of copper planes, and the environment surrounding the circuit board. This chapter is presented as additional information on the existing charts in IPC 2221, as well as an aid to bridge the gap between the old and new charts that are presented.

Current carrying capacity is commonly defined in terms of the temperature rise in a trace as a result of applying a specific amount of current to a specific size trace. The temperature rise is dependent on:

The current level The board thickness The cross-sectional area of the trace The thickness of the trace for a given cross-sectional area The distance from a trace to copper planes The board material The environment (still air, forced air, vacuum, etc.) Skin effect at high speed (GHz)

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mnemonic: An abbreviation, an aid for remembering the code of a processor NVRAM: Acronym for Non-Volatile Random Access Memory RAM with battery backup for retaining the contents of the RAM when the main power is put off oscilloscope: An instrument to observe electrical signals as a function of time It has a fluorescent or LCD display for observing the signals object code: A program that a processor can execute directly pipeline: Refers to an internal implementation of a processor in which the instructions are continuously being fetched by a section of the processor and placed in a queue for execution by the execution section of the processor, which in turn places the results in an output queue to be stored back to the designated destination A nonpipelined processor, on the other hand, fetches an instruction, executes it, and stores the results before fetching the next instruction.

Circuit Board Designs Circuit boards can be extremely different from one design to another. They can vary from a double-sided board the size of a postage stamp to a 40-layer board that is 2 ft. wide and 4 ft. long. The environment in which they operate is also a consideration for example, whether they are used on earth, in space, or on some other planet. Because there is such a broad range of printed circuit board (PCB) construction and materials, a single trace-sizing chart cannot be expected to describe the temperature rise of a trace as a function of current for all boards. Fine-line and space, heavy copper, single-layer boards, and multilayer boards all constitute different configurations in which traces with the same cross-sectional area could vary from 10 to 70 C, or more for the same amount of applied current.

Conductor (Trace) Sizing Charts Five different charts are presented in this chapter. The first has been around since the beginning of the printed circuit industry and is intended for external traces. The second is for sizing internal traces. The third and fourth are for internal and external traces. These are from more recent studies and are referred to as baseline charts. The fifth is used with the baseline charts to account for the heat spreading and cooling effect when copper planes exist in the board. Even with these charts, there are times when charts alone do not offer enough information and analysis tools must be used to solve current carrying capacity problems. The charts included in this chapter are presented as a guide for sizing copper traces. There are limitations to their use and those limitations are discussed in the trace-sizing guidelines. The trace-sizing charts are used to manage trace heating, which includes sizing parallel conductors and vias. Finally, design problem areas such as swiss-cheese effect and environments are discussed at the end of this chapter. For each set of charts, a discussion of what each chart represents and where it best applies for circuit board design applications is included. The charts included are as follows:

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